Hypertec 512MB PC2700 (Legacy) memory module 0.5 GB 1 x 0.5 GB DDR 333 MHz DDR Any repurposed components are removed

Any repurposed components are removed within a full ESD environment and then used to manufacture new modules

A Panasonic equivalent 2GB SODIMM (PC3-8500)

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3

Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Memory form factor 288-pin DIMM Memory ranking 2 ECC Yes Memory clock speed 2666 MHz Internal memory type DDR4 Features Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Memory form factor 288-pin DIMM Memory ranking 2 ECC Yes Memory clock speed 2666 MHz Internal memory type DDR4

Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 2 x 8 GB Internal memory 16 GB Memory form factor 240-pin DIMM Memory ranking 2 ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Memory layout (modules x size) 2 x 8 GB Internal memory 16 GB Memory form factor 240-pin DIMM Memory ranking 2 ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3

Hypertec 512MB PC2700 (Legacy) memory module 0.5 GB 1 x 0.5 GB DDR 333 MHz DDR Any repurposed components are removedA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to