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Intel - LE82GL960 TSDC0011 and assembly operations such as
Intel - LE82GL960 TSDC0011 and assembly operations such as
Intel - LE82GL960 TSDC0011 and assembly operations such as
Intel - LE82GL960 TSDC0011 and assembly operations such as

Intel - LE82GL960 TSDC0011 and assembly operations such as

SKU: 68565223463

4.8
USD187.50 USD214.50

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Description

and assembly operations such as Flip Chip attachment to PWB substrates

Ball Size-0

This convertor used to convert Samsung 96 Pin to 51 pin and mainly used for Samsung QN and QA series Motherboard

Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors

Melting Range- 180 to 205 degree celcius

Intel - LE82GL960 TSDC0011 and assembly operations such as

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