Hypertec 256MB PC2700 (Legacy) memory module 0.25 GB 1 x 0.25 GB DDR 333 MHz DRAM 2 V Memory ranking 2

2 V Memory ranking 2 ECC No Memory clock speed 2400 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Backlight No Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for Laptop Memory form factor 260-pin SO-DIMM CAS latency 17 Memory voltage 1

1 V Design Backlight No Product colour Green Technical details Product colour Green Chips organisation 1Rx8 Compliance certificates CE

35 V Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 2 x 8 GB Internal memory 16 GB Memory form factor 240-pin DIMM Memory voltage 1

Design Cooling type Heatsink Technical details Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 4 GB Internal memory 4 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3L Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 4 GB Internal memory 4 GB Component for Laptop Memory form factor 204-pin SO-DIMM Cooling type Heatsink ECC No Memory clock speed 1600 MHz Internal memory type DDR3L

2 V Memory ranking 2 ECC No Memory clock speed 2133 MHz Internal memory type DDR4 Weight & dimensions Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g Packaging data Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g

Hypertec 256MB PC2700 (Legacy) memory module 0.25 GB 1 x 0.25 GB DDR 333 MHz DRAM 2 V Memory ranking 2A Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to