Hypertec 46C7489-HY (Legacy) memory module 16 GB 1 x 16 GB DDR3 1066 MHz ECC DDR Memory Buffered memory type Unregistered

Memory Buffered memory type Unregistered (unbuffered) Internal memory 2 GB Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1066 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Internal memory 2 GB Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1066 MHz Internal memory type DDR3

Memory Buffered memory type Unregistered (unbuffered) Internal memory 2 GB Memory form factor 240-pin DIMM ECC No Memory clock speed 1066 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Internal memory 2 GB Memory form factor 240-pin DIMM ECC No Memory clock speed 1066 MHz Internal memory type DDR3

35 V Memory ranking 4 ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3L Features Buffered memory type Registered (buffered) Internal memory 32 GB Memory form factor 240-pin DIMM Memory voltage 1

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3

A Fujitsu equivalent 8 GB Unbuffered Non-ECC DDR3 SDRAM - SO-DIMM 204-pin 1600 MHz ( PC3-12800 ) from Hypertec

Hypertec 46C7489-HY (Legacy) memory module 16 GB 1 x 16 GB DDR3 1066 MHz ECC DDR Memory Buffered memory type UnregisteredA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to