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wobble-free installation on compatible grinders and rotary tools
It performs exceptionally well in wet cutting environments
Material Removal
circular saw
Ideal for use on a wide range of materials—including glass
18" Grooved Polyurethane Cerium Oxide Polishing Pad – Glass & Mirror Finishing Buffing Wheel Backing:Magnetic wobble-free installation on compatible grindersThe LP 66 polyurethane cerium oxide polishing pads are engineered for professionals in lapidary optics, semiconductor, and glass manufacturing who demand uncompromising performance and sub micron precision. Constructed from hydrophobic polyurethane and infused with cerium oxide, the LP 66 Pad delivers rapid material removal while maintaining ultra low friction and heatideal for polishing heat sensitive materials like optical lenses, LCD substrates,
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